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Manufacturing process of high-purity metal sputtering target

The preparation process of sputtering targets mainly includes smelting casting method and powder sintering method. Commonly used smelting methods include vacuum induction melting, vacuum arc melting and vacuum electron bombardment melting. Compared with the alloy prepared by the powder method, the impurity content (especially the gas impurity content) of the smelting alloy target material is low, and the density and size can be increased. However, for two or more metals that have a large difference in melting point and density, it is generally difficult to obtain an alloy target with a uniform composition by the ordinary smelting method; the powder metallurgy process has an easy to obtain uniform fine crystal structure, save raw materials, and produce efficiency High advantage. When preparing target materials by powder metallurgy, the key is to select high-purity, ultra-fine powder as raw material. Select the forming and sintering technology that can achieve rapid densification to ensure the low porosity of the target and control the grain size. The preparation process strictly controls the introduction of impurity elements. Commonly used powder metallurgy processes include hot pressing, vacuum hot pressing and hot isostatic pressing (HIP).

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