Boyd Corporation, an industry leader in thermal management, environmental sealing and protection solutions, has announced the acquisition of PiMEMS, a leading developer of titanium microtechnology and ultra-thin devices. The acquisition is strategically in line with Boyd's commitment to innovate and support the next generation of electronics.
PiMEMS is committed to using titanium's excellent mechanical, chemical and electrical properties and biocompatibility to invent and build titanium-based MEMS devices, providing thin, efficient, and reliable technology for many applications.
PiMEMS Microelectronics Solutions
PiMEMS has developed titanium-based thermal ground plane (TiTGP) technology to provide the thinnest and lightest high-performance planar thermal solution for microelectronic applications.
PiMEMS Health Medical Platform
PiMEMS has developed a titanium-based biocompatible microneedle platform for analyzing blood chemistry and detecting certain molecules.
PiMEMS core technology
PiMEMS holds 10 patents on bulk titanium alloys and other metal micro-nano manufacturing technologies for building and packaging metal MEMS micro-devices.
With this acquisition, PiMEMS has brought Boyd a professional titanium alloy micrometal and nanometal manufacturing intellectual property for building metal-based microdevices. As product designers continue to pursue smaller, lighter, and more powerful devices, PiMEMS technology has invaluable value in designing and manufacturing high-performance microelectronics and ultra-thin thermal solutions that can exceed the ever-changing Performance requirements.
Boyd CEO Mitch Aiello said, "Boyd is committed to investing in forward-thinking technology that meets customer goals and technology paths. Our customers are global leaders in their respective industries. Our mission is not only to keep up with their needs and Requirements, and to predict design bottlenecks and prepare solutions that will ensure future success. Industries from aerospace to mobile electronics continue to demand that devices provide higher power in better configurations, which means lighter and more compact Thermal management needs and higher thermal performance. We leverage our extensive portfolio of titanium microtechnology to consolidate our market-leading R & D resources, enabling lighter and thinner high-performance cooling solutions than any other product on the market. "
The addition of PiMEMS further strengthens Boyd's existing strong R & D activities in ultra-thin, high-performance cooling. Investment in innovation allows Boyd to ensure full support for customers' technology development plans and accelerate time to market for next-generation applications. The new team is now working in Boyd's professional thermal division, Aavid, and their capabilities complement and strengthen existing design teams and Boyd's broad technology portfolio.