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Polyimide substrate, COF flexible packaging substrate FPC and IC substrate supplier for Apple, Samsung, Panasonic Hay:I04SZDB

SZDB Electronic Materials Technology Co. Ltd is a listed company in Shenzhen Stock Exchange. It was established in 2001, with an investment of 180 million RMB. The company has been specializing in R & D and manufacturing of flexible circuit and its materials. To date, SZDB has developed a national R & D center for flexible circuit and its materials, and is the most powerful manufacturer starting from design, manufacturing, to service of flexible materials, encapsulation for flexible circuit board, and its related products.

 SZDB has its own intellectual rights, including the core technology from manufacturing flexible material, encapsulating flexible circuit to encapsulating chip. It provides the value chain service from design, manufacturing, service and solutions for encapsulation.

The main products include flexible FCCL, high-intensity FPC, COF circuit for chips encapsulation, encapsulation products, as well as the encapsulation-related heat curing adhesive and micro adhesive glue film. Those products can be used in high-tech end products, such as in commercial electronics, medical device, special computer, digital display, high-tech equipping industry, national defense, military, and airspace industry.

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