Shin-Etsu Chemical Industry has launched "quartz glass fiber cloth" and "thermosetting low-dielectric resin" according to the needs of the 5G era, which can be used in 5G high-band electronic devices and circuit boards, antennas, radar domes, etc. In addition, Shin-Etsu Chemical also increased the variety of heat sinks. In this product development, we signed a concession contract with NOVOSET to manufacture and sell thermosetting low-medium resins.
1. Quartz glass fiber cloth (trade name: SQX series)
The dielectric constant of quartz glass fiber cloth is less than 3.7, the dissipation factor is less than 0.001, the coefficient of linear expansion is less than 1ppm / ° C, and the characteristics of transmission loss (degree of deterioration of electrical signals) are extremely excellent. This product is most suitable as the core material for 5G ultra-high-speed wiring boards, fiber-reinforced resin parts for antennas and radar domes, etc.
The quartz cloth is composed of very fine quartz wires with a thickness of 20 μm or less, which can realize the thinning of the laminated substrate. Quartz rarely produces alpha rays, which can prevent equipment misoperation caused by radiation. Shin-Etsu Chemical plans to increase production capacity as needed.
2. Thermosetting low dielectric resin (trade name: SLK series)
This is a low-elastic resin that is close to fluororesin and has a low dielectric constant and high strength. Its high frequency band (10 ~ 80GHz) has a dielectric constant below 2.5 and a dissipation factor below 0.00025. This is the lowest level of thermosetting resin. Due to the low hygroscopicity of the product and its high adhesion to low-thickness copper foil, it is also used in FCCL (flexible copper foil substrate).
With regard to ultra-low loss dielectric resins that are resistant to high temperatures and extremely low moisture absorption, Shin-Etsu has entered into a license agreement with Novoset to add these products to Shin-Etsu's product line to enhance their communications that require high heat resistance and reliability The market competitiveness of base station copper clad laminates, rigid circuit boards, antennas and radar domes.
3. Heat dissipation sheet (trade name: SAHF series)
Because 5G has high requirements for heat release performance, Shin-Etsu Chemical has newly developed and introduced a sheet for bonding heat dissipation materials, a sheet that is bonded by heat fusion, and hardening. Shin-Etsu's heat sink products have a thermal conductivity range from 5W / mK to 100W / mK, which is suitable for power semiconductors and automobiles and other fields with high reliability requirements.