On July 14, Showa Denko (SDK) announced that it will start supplying samples of moisture-resistant thermally conductive aluminum nitride fillers for semiconductor devices. According to the evaluation results, compared with the unmodified aluminum nitride powder, the ammonia gas released by the hydrolysis of the powder after the surface treatment is greatly reduced to 1 in 10,000.
Aluminum nitride has a high thermal conductivity, and has high insulation, almost the same thermal expansion coefficient as silicon, and corrosion resistance to chlorinated gas used in the production of semiconductors. However, if moisture adheres to the surface of aluminum nitride, a hydrolysis reaction will occur, producing corrosive ammonia gas.
ALN+3H2O=AL(OH)3+NH3
Under the trend of semiconductor high-power and miniaturization, heat dissipation demand has become a key research direction. Therefore, compared with aluminum oxide, boron nitride, etc., aluminum nitride materials with higher thermal conductivity have a bright future.
The SDK has successfully developed a technology to treat the surface of aluminum nitride with an ultra-thin film to prepare aluminum nitride filler with excellent moisture resistance and high thermal conductivity, and this surface treatment will not reduce the aluminum nitride filler injected into the resin Thermal conductivity. At this stage, the SDK began to provide samples, and plans to start mass production in 2023. Combined with its existing alumina and boron nitride filler products, to provide a more comprehensive thermal conductive filler products.