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Spring glass using German laser source and equipment manufacturer LPKFLIDE (The Laser-Induced Deep Etching) technology, or application on ultra-thin glass substrates next year

CINNO Research's industry information, "Spring Glass" technology, which can make up for the shortcomings of foldable smartphones with glass material covers, is here. It is understood that this technology is likely to be used on foldable mobile phones with ultra-thin glass (UTG) substrates next year, and the change in the competitive landscape around foldable mobile phone cover materials has attracted widespread industry attention.

According to industry news, a "spring glass" that does not change the inherent characteristics of the glass even when the bent portion is expanded or contracted is irradiated with laser light on the foldable glass. Manufacturers supplying foldable panels are testing their functions and considering the introduction. Whether foldable phones equipped with UTG covers will use this technology has attracted widespread attention in the industry.

The core technology of spring glass is laser. Because glass has a hard property, unlike transparent PI, when it is dropped or subjected to other physical impacts, a gap or easily breaks.

Spring glass is a technique that can make up for this defect of cover glass. Irradiating the laser on the curved part of the foldable mobile phone makes the glass elastic like a rubber and can be stretched. Its characteristic is that it does not change the inherent optical characteristics and hue of glass, but only changes in properties.

When the bent portion is stretched, the pressure applied to the glass when the portion is bent can be reduced.

In the Outfolding method, the possibility of using transparent PI is greater than that of glass. Because when the foldable phone is dropped, the curved part is impacted, and the glass is easily broken. When the cover glass adopts spring glass technology, whether it is folded inward or outward, the glass material will be in a more favorable position.

German laser source and equipment manufacturer LPKF has disclosed the LIDE (The Laser-Induced Deep Etching) technology that can make curved parts of foldable glass into spring glass. LPKF was awarded the "SID Honorary Award" as a startup company introducing core technologies during the display week of the International Institute of Information Display (SID) held in the United States in May this year for this technology.

Industry experts said that "it is understood that panel makers are considering the use of foldable glass that can be flexed with telescopic technology", and said that "the introduction of UTG foldable mobile phones may actually adopt the possibility of changing the technology and deserves continued attention."

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