To better meet the changing needs of connector manufacturers, Sumitomo Chemical has developed three new SumikaSuper LCP grades specifically designed for high-speed connectors, including backplanes and automotive connectors for infotainment. SumikaSuper E6205L is a low dielectric constant polymer, which is ideal for connectors that require higher data transfer speeds. However, for connectors that require both a lower dielectric constant and a lower loss factor (lower loss tangent), a unique LCP with a different chemical structure is called SumikaSuper SR1205L, which can better meet the connector geometry and design Requirements.
For high-speed digital and wireless devices that need to consider electromagnetic interference (EMI), SumikaSuper SZ6911EM has become a third-level product due to degraded signal quality and is specifically designed to provide EMI shielding. This grade combines ferromagnetic particles to convert incident EM waves into thermal energy, which can then be discharged through a thermal management system. Each new level benefits from Sumitomo Chemical's expertise in polymer synthesis and compounding.
LCPs are a family of polymers that produce thermoplastic parts with unique processing characteristics and extremely high performance, so they are often used to replace metals, ceramics, and other plastics because of their high heat resistance, excellent flowability, and weight reduction Or reduce the chance of side wall margin. Most commercial LCPs are aromatic polyesters, which are characterized by high thermal and mechanical properties, inherent flame retardancy, good weather resistance, excellent electrical properties, high resistance to stress cracking and chemical inertness. This makes them ideal for electrical and electronic components (including fiber optic cables, PCBs, chip carriers, connectors (traditional, radio frequency (RF) and fiber optics) and other surface mount components), micro-electromechanical systems (MEMS)), automotive Applications (including ignition and transmission system components, lamp holders, pump components, coil forms and sensors), printer / copier / fax components, cookware, high-barrier / distilled food containers, and chemical processing components (including pumps, meters and valves) .
LCP parts can usually be joined by thermoplastic welding, especially by ultrasonic and laser welding. Due to their highly rigid structure of molecular chains and their liquid crystal properties, they tend to be almost linear and occupy a stacked orientation, maintaining their order regardless of the solid or liquid phase, and LCP is highly anisotropic. Basically, primary bonds within LCP polymer chains are very attractive and difficult to break, while secondary bonds between molecular chains are weaker and easier to break.
Although most thermoplastics, especially fiber-reinforced thermoplastics, exhibit a certain degree of anisotropy after processing, the moldability of LCPs can vary significantly in the flow and transverse flow directions, which is designed for these polymers You need to pay attention (and avoid challenges) to the characteristics of parts and tools. The highly ordered and linear nature of these molecular chains makes LCP self-reinforcing in the direction of flow and helps to obtain excellent mechanical properties. However, the high anisotropy of LCP also means that the welds (where the flow fronts with different molecular orientations converge) are weaker and therefore prone to warping and thermal expansion differences. Therefore, LCP is usually reinforced with glass fibers and mineral fillers, not to increase stiffness and strength, but to reduce anisotropy.
Warpage can be reduced by proper gate design in the injection tool. Due to its high performance, LCP is priced accordingly. However, because of their high melt flow rate, fast solidification time, and low thermal expansion in the direction of flow, these polymers can form thin-walled parts, have short molding cycles, and provide high performance with low quality and low material use-all This helps offset higher initial material costs. (They can also be molded into large, thick-walled parts.) The typical thermal stability of LCPs allows processors to effectively reuse regrind and recycle scrap parts, again reducing material loss and reducing effective part costs.