On the afternoon of March 27, the foundation stone laying ceremony of Hongshuo Technology (Ningbo) Co., Ltd.'s solder ball, solder bar and other semiconductor integrated circuit material production projects was started in Xingang Town.
The investor of Hongshuo Semiconductor's integrated circuit material production project is Taiwan Hengshuo. It is the world's leading supplier of chip-level packaging materials and the only solder ball supplier of TSMC. The Hongshuo project covers an area of 18.2 acres, with 40 acres reserved, with a total investment of 340 million yuan. It is estimated that the annual output value of the project will reach 1.07 billion yuan after it reaches capacity. Hongshuo plans to increase capital to build 10 new production lines after two production lines are put into operation in 2020. It is estimated that the monthly production capacity of solder balls will reach more than 150 billion pieces. It aims to become the world's largest solder ball supplier base by 2025.