Taiwan's vertical cavity surface emitting laser (VCSEL) epitaxy and chip maker HLJ Technology (Hualijie Technology Co., Ltd., hereinafter referred to as "Hualijie") has ordered multiple MOCVD equipment AIX 2800G4-TM. The order will be used to expand Wafer's wafer capacity while increasing VCSEL's wafer size from 4 inches to 6 inches.
Aixtron said that its fully automatic planetary reactor system will be available in an 8 x 6-inch configuration in the fourth quarter of 2018.
According to Aixtron, the AIX 2800G4-TM is regarded as the industry standard for high-end laser applications including VCSELs, especially in the field of 3D sensing. This is because the planetary reactor provides excellent process performance and can precisely control the thickness of the epitaxial layer And uniformity. Therefore, factories using this system can provide high quality products while meeting high output.
Larry Lai, General Manager of Holtek, said: "In order to meet the rapid growth of the market for epitaxial wafers and chip-level VCSELs, we have decided to increase the wafer size to 6 inches. Starting from the fourth quarter of 2018, two new sets were ordered. The Aixtron MOCVD system will arrive at Holtek. In the second quarter of 2019, the first complete VCSEL production line will be put into use. "
"We are glad that our new partner, Holtek, has selected the AIX 2800G4-TM system. This set of equipment can achieve first-class VCSEL epitaxy and chip manufacturing mass production processes. Looking forward to our cooperation with Holtek, we will fully assist Holtek Czech production processes are perfectly matched to our equipment, "said Bernd Schulte, CEO of Aixtron.