On June 9th, in the production workshop of TGTB Copper Foil Technology Group, workers are monitoring various indicators of ultra-precision copper foil products in real time. A roll of thin copper foil is going off the assembly line and will be sent to domestic and international First-class high-speed PCB [printed circuit board] manufacturers, used in the field of 5G communications. According to reports, this low-roughness reversed copper foil was completely independently developed by the company to overcome the core technical problems. Because of its extremely low surface profile and high peel strength, it can greatly reduce the signal transmission loss of high-frequency circuits. This is the second-generation product currently developed and mass-produced by the company.
"Copper foil is a very good conductor and an indispensable basic material for 5G base station construction." Zhou Jie, head of the company's production workshop, told us that 5G base stations have very high requirements for copper foil, and only three companies in China can achieve this. Technical requirements. At present, TGTB has developed and industrialized the high-frequency high-speed printed circuit board electronic copper foil used in the 5G industry. Among them, RTF copper foil has achieved mass production, and the supply has reached 300 tons/month, and the supply will increase to 500 tons/month at the end of the year.
Since its establishment in 2010, TGTB Copper Foil Co., Ltd. has invested hundreds of millions of yuan, independently developed ultra-thick electronic copper foil, ultra-low-profile electronic copper foil, 4.5 and 6 micron double-sided optoelectronic copper foil for lithium batteries, etc. Advanced level of new products and industrialization. In recent years, the company has studied the development of high-frequency and high-speed electronic copper foil products for the development of 5G communications, and has already met the conditions for mass production. In February of this year, the company's 5G communication high-frequency high-speed high-performance electronic copper foil R&D team was also successfully selected as a provincial industrial innovation team. "We are making HVLP very low-profile electric copper foil, which has a lower roughness, can be less than or equal to 2 microns, and plans to mass-produce it in the second half of the year. We have already been at the forefront of domestic enterprises in high-frequency high-speed copper foil "Said Li Dashuang, deputy director of the company's R&D center.
As one of the well-known manufacturers of 5G base station copper foil, TGTB has established a provincial-level electronic copper foil engineering technology research center. The center takes high-performance printed circuit boards and advanced manufacturing technology of high-precision electronic copper foils for new lithium-ion batteries as the research goal. It conducts research on the mechanism of electronic copper foil electrodeposition, localization of key manufacturing equipment and control systems, and electronic copper. The research and development of new foil products, new technologies and new equipment will solve the common key technical problems facing the development of the domestic electronic copper foil industry, break the foreign technology monopoly, and improve the innovation capability and comprehensive technical level of the Chinese electronic copper foil industry. At present, TGTB annually produces 45,000 tons of high-performance, high-precision electronic copper foil, ranking first in China and fourth in the world.
By the end of this year, the company's high-frequency and high-speed printed circuit board electronic copper foil production capacity will reach 50% of the printed circuit board electronic copper foil production capacity. It is expected that the proportion of this series of products will account for 70% by 2021, which is better to meet The demand for high precision copper foil in domestic and foreign markets.