HSGJ Heat Dissipation Technology Corporation is committed to the research and production of high-performance semiconductor module heat dissipation substrates.
The main products include copper needle type heat dissipation substrate and copper flat bottom heat dissipation substrate, both of which are used in the heat dissipation system of power semiconductor modules. Among them, copper Pin Fin/needle type heat dissipation substrate is used in the EV field, and copper flat bottom heat dissipation substrate is used in new energy generation and other fields.
The copper Pin Fin/needle type heat dissipation substrate is an important component of the power semiconductor module used in the motor controller of new energy vehicles. At the same time, the company's products also have broad application prospects in fields such as new energy generation and energy storage.
The company's sales of automotive grade power semiconductor module heat dissipation substrates account for 29.31% of the global market share.
Thanks to the technological innovation and accumulation of HSGY, its competitive advantage has become increasingly prominent. Its customers cover well-known power semiconductor manufacturers at home and abroad, and its products are exported to the markets of developed countries such as Europe countries and Japan, gradually replacing the market share of competitors such as Taiwan, China, Japan and the United States.
The company is the largest supplier of power semiconductor module heat dissipation substrates for Infineon new energy vehicle motor controllers, a global power semiconductor enterprise.
At the same time, it has established long-term and stable cooperative relationships with power semiconductor manufacturers such as Robert Bosch, Onsemi[ON Semiconductor],STMicroelectronics,STARPOWER,Silan Microelectronics,Hitachi,CRRC Times,SMIC Integrated…