The copper/molybdenum/copper (CMC) material is a flat laminated composite material with a sandwich structure. It uses pure aluminum as the core material and is covered with pure copper or dispersion strengthened copper on both sides. The thermal expansion coefficient of this material can be adjusted as required, with high thermal conductivity, excellent high temperature resistance, and good mechanical processing performance. It is used as a heat dissipating element and substrate connector in large-scale integrated circuits and high-power microwave microelectronic devices. It has been developed rapidly and has great development potential.
The American company AMAX produced CuMo/Cu (CMC) composite materials using hot-rolled composite methods and applied for related patents, which have been used in the electronic equipment of the B2 stealth bomber. The structure of CMC is a three-layer composite structure with high hardness, tensile strength, thermal conductivity and electrical conductivity. This is because the middle layer of CMC is a molybdenum plate, and the strength, electrical and thermal conductivity of molybdenum are high. U.S. Polymetallurgical, Polese, Elco and other companies adopt online continuous rolling and compounding technology to produce electronic packaging strips of various sizes, partial or full cladding, and particle-enhanced electronic packaging produced by powder metallurgy methods such as molybdenum copper and tungsten copper. Compared with materials, the rolling composite method produces flat composite electronic packaging materials with high efficiency, low production cost, and can produce large-scale packaging materials. Therefore, flat composite electronic packaging materials are very beneficial to the production of the electronics industry and are easy to produce " Benefits of scale".