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The Every layer interconnection (ELIC) HDI PCB manufacturer won Huawei’s Global Core Supplier Gold Award Hay:I04GDFZ

At the Huawei Core Supplier Conference held recently, GDFZ Electronic Materials Technology Group won Huawei’s "2020 Global Core Supplier Gold Award". This award means that GDFZ is one of Huawei’s best suppliers in terms of quality, delivery, and cost services. One.

Huawei has a large-scale supply chain and partners around the world, and the "Core Supplier Gold Award" recognizes and commends the best among them.

In cooperation with Huawei, GDFZ has built an efficient and high-quality Huawei service team. With strong R&D technical strength, excellent product quality, fast and timely delivery response capabilities, and excellent performance ratings, Founder PCB is among Huawei PCB suppliers stand out.

In 2019, GDFZ also won the "Quality Excellence Award" at the "Huawei 2019 CBG Supplier Quality Conference" and was the only PCB supplier to win the award.

GDFZ is one of the leading PCB manufacturers in China. Currently, it has formed product advantages centered on every layer interconnection (ELIC) HDI PCB, hard and soft HDI, high-frequency high-speed server PCB, RF antenna PCB, and fast storage SSD.

GDFZ has outstanding market performance in the fields of mobile intelligent terminals, wireless base stations, industrial intelligent control, automotive entertainment, big data centers and wearable consumer electronics.

Over the years, GDFZ has undertaken a number of China's national torch plan and major special projects, and won the second prize of National Science and Technology Progress Award, China Patent Excellence Award, the Ministry of Education Science and Technology Progress Award, and the Provincial Science and Technology Progress Award. Technology awards.

In order to meet the demand for high-end products in the 5G era, GDFZ invested 1.68 billion yuan to build a new F7 factory in the Fushan Industrial Park at the beginning of this year.

At present, the main plant of the project has been completed and equipment installation is in progress. It is expected to be officially put into operation in the second half of 2021.

It is reported that the project is positioned as a high-multilayer PCB mass intelligent manufacturing base, covering an area of 108,000 square meters, with a planned production capacity of 1.1 million square feet per month, and its products cover communication equipment, data centers, car networking, consumer electronics, industrial control medical, and communications 6 major application areas of the terminal.

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