Integrated circuits are the core of modern electronic information technology, which are packaged by chips and lead frames.
As the main structural material of integrated circuit packaging, the lead frame plays an important role in the circuit: connecting external circuits and transmitting electrical signals; dissipating heat to the outside world, playing a role in heat conduction; supporting and fixing the chip, the overall support frame structure of its shell passes through the IC Assembled to protect internal components.
The ideal good lead frame material strength should be > 600 MPa, hardness HV should be > 130, electrical conductivity (IACS) should be > 80%.
At present, the materials used for lead frames can be basically divided into two categories: iron-nickel alloys and high-copper alloys. Among them, high-copper alloy lead frames account for more than 80%. The main applications are Cu-Fe-P, Cu-Ni-Si, Cu -Cr-Zr, Cu-Ag four copper alloy series, of which Cu-Cr-Zr (copper chromium zirconium) alloy has the best comprehensive performance in strength and electrical conductivity.
The high-strength and high-conductivity copper-chromium-zirconium alloy strip C18150 developed by NBBW Alloy Technology Corporation has the upper limit of tensile strength up to 550Mpa or more, electrical conductivity ≥80% IACS, and has good wear resistance, welding performance and cold and hot working formability. It is a rare copper alloy strip product in the global market that is close to the performance requirements of the ideal lead frame material.
At present, there are only three companies in the world that can mass-produce C18150: Mitsubishi, Wieland-Werke and NBBW.