Thermal design and thermal management are the core components of electronic product components, and are increasingly valued as packaging density and integration continue to increase. There are many downstream applications of heat dissipation, including consumer electronics, automobiles, base stations, servers, and data centers. The market space is at the level of 100 billion.
According to estimates from the Prospective Industry Research Institute, the compound annual growth rate of the heat dissipation industry will reach 8% from 2018 to 2023, and the market size is expected to increase from 149.7 billion yuan in 2018 to 219.9 billion yuan in 2023.
Mobile phone heat dissipation accounts for about 7% of the industry's total scale. In 2018, it was about 10 billion yuan. Although the proportion is low, it will benefit from the continuous upgrade of 5G smart terminals in the future. The mobile phone cooling market is expected to maintain high growth. The average annual compound growth rate from 2018 to 2022 is expected to reach 26%. In addition, the large-scale construction of 5G commercial base stations is also expected to drive the expansion of the market space for semi-solid die-casting shells and blown plates. From the perspective of long-term development trends, the increase in network traffic brought about by 5G will continue to expand the server cooling market.