On January 3, 2023, China's leading AMB-silicon nitride ceramic substrate manufacturer: SZBM Electronic Materials Technology Corporation announced that:
The company will invest 5 billion yuan to build a new production base for IGBT ceramic liners and IC packaging carrier plates.
The newly-built production base of IGBT ceramic liner and IC packaging carrier is mainly engaged in IGBT ceramic liner and packaging carrier products for memory chips, MEMS chips, high-speed communication market and Mini LED fields.