On August 18, China's leading high-end copper clad laminate manufacturer SHNY Electronic Materials Technology Group officially listed on the Shanghai Stock Exchange.
SHNY's main business is the design, research and development, production and sales of composite materials and products such as copper clad laminates and bonding sheets. In this IPO, SHNY intends to use the 920 million yuan raised funds for high-frequency and high-speed electronic circuit substrate construction projects and R&D center transformation and upgrading projects with an annual output of 15 million square meters in 5G communications and other fields.
From 2017 to 2019, Nanya New Materials realized revenues from main operations of 1.639 billion yuan, 1.838 billion yuan, and 1.758 billion yuan; net profits deducted from non-parents were 114 million yuan, 103 million yuan, and 138 million yuan, respectively.
SHNY has a good relationship with many PCB manufacturers. High-speed board technology is certified by Huawei
SHNY has long been committed to independent innovation of copper clad laminate products. In the course of 20 years of development, the company has successively achieved major breakthroughs in materials such as lead-free and halogen-free, ultra-thin, high-frequency and high-speed technologies. SHNY's ultra-thin craftsmanship and reliability are at the domestic advanced level and are highly recognized by Tripod Technology, one of the world's leading PCB multilayer board companies. The high-speed board technology has been certified by Huawei, ZTE and other leading communications equipment companies.
With the breakthrough of technology research and development, the improvement of product system and the deepening of market development, SHNY's products and brands have been widely recognized by well-known downstream customers. The company has established long-term good cooperative relations with more than 50 well-known international PCB manufacturers, and has been rated as "Excellent Supplier" by Tripod Technology for many years.
CCL product revenue accounted for nearly 80% in 2019
SHNY's main products are copper clad laminates and bonding sheets. In 2019, copper clad laminate products achieved revenue of 1.381 billion yuan, accounting for 79.41%; bonded sheet products achieved revenue of 358 million yuan, accounting for 20.59%. Details are as follows:
1. Copper Clad Laminate
The full name of copper clad laminate is copper clad laminate. It is a plate-shaped material formed by impregnating a reinforcing material with resin glue, one or both sides with copper foil, and then hot pressing. It is responsible for the electrical conductivity, insulation, and insulation of the printed circuit board. It supports three major functions and is the core material for making printed circuit boards.
Due to the numerous downstream application fields and the different performance requirements, SHNY's product specifications are as many as thousands. According to the glue system (resin formulation system), it can be roughly classified into ordinary FR-4 and lead-free compatible FR-4 (hereinafter referred to as "Lead-free board"), halogen-free and lead-free compatible FR-4 (hereinafter referred to as "halogen-free board") and high-frequency high-speed and other copper clad laminates. The details are as follows:
2. Bonding sheet
Bonding sheet, also known as prepreg, is the previous product in the production process of copper clad laminate. The bonding sheet determines the overall performance of the copper clad laminate to a large extent. It is the embodiment of the formula technology and core added value of the copper clad laminate product.
When downstream multi-layer boards or HDI customers purchase copper-clad laminates from copper-clad laminate manufacturers, they often need to purchase bonding sheet products of the same manufacturer with the same specifications, and use them as bonding and insulating materials between layers of multi-layer boards or HDI layers. . The sales of adhesive sheets can reflect the comprehensive ability of copper clad laminate manufacturers to serve mid-to-high-end fields such as multilayer boards or HDI.