CSSH Microelectronic Materials Technology Corporation is committed to R&D and production of high-performance electronic packaging materials such as W/Cu composites, Mo/Cu composites, Cu/Mo/Cu sandwich structure composites, and Cu/Mo70Cu/Cu sandwich structure composites.
The company has established a joint research and development center with Central South University of China, which is an international leader in the field of electronic packaging materials. Its technical achievements are at the international advanced level, and its products have won the second prize of provincial science and technology progress.
The high-pressure forming process of tungsten skeleton developed by CSSH belongs to the international innovative technology, which is used to manufacture electronic packaging materials.
This technology has won the first prize of provincial technology invention and the second prize of national defense science and technology progress
At present, it is the largest manufacturer of high-performance electronic packaging materials in China and provides four new types of electronic packaging materials:
Tungsten-copper composite
W-Cu composite series, specific brands: W90Cu, W85Cu, W80Cu, W50Cu…
It has both low expansion property of tungsten and high thermal conductivity property of copper. Its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material.
Tungsten-copper composite can form a good thermal expansion match with ceramic materials, semiconductor materials, metal materials, etc. It is mainly used in RF, microwave, semiconductor high-power packaging, optical communication and other industries.
Mo Cu composite series, specific brands: Mo70Cu, Mo60Cu, Mo50Cu, etc;
Molybdenum copper composite
Mo-Cu composite series, specific brands: Mo70Cu, Mo60Cu, Mo50Cu…
Molybdenum copper is a composite of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity.
However, the density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields.
Cu/Mo/Cu sandwich structure composite
Cu/Mo/Cu sandwich structure composite series: the thickness ratio can be from 1:1:1 to 13:74:13;
Copper/molybdenum/copper is a composite material similar to "sandwich" structure, with metal Mo as the core material and pure copper coated on both sides. Its expansion coefficient and other properties can be designed, and it also has the characteristics of high strength, high thermal conductivity and punching and molding.
It is often used in some important occasions as a low expansion and heat conduction channel for heat sink, lead frame and multilayer printed circuit board (PCB).
Cu/Mo Cu/Cu sandwich structure composites
Cu/Mo70Cu/Cu sandwich structure composite series: thickness ratio 1:4:1 and others.
Copper/molybdenum copper/copper is sandwich structure, the core material is metal Mo70Cu alloy, and both sides are covered with pure copper. Its thickness ratio is 1:4:1, and it has the characteristics of high strength, high thermal conductivity and punching and forming.
It is often used in RF, microwave and semiconductor high-power device packaging.
KOVAR alloy
Conform to standard of ASTM F15 and UNS K94610;
KOVAR alloy is a hard glass iron based sealing alloy containing 29% nickel and 17% cobalt.
The alloy has a linear expansion coefficient similar to that of hard glass in the range of 20~450 ℃. It can be effectively sealed and matched with the corresponding hard glass. It also has a high Curie point and good low-temperature structural stability. The oxide film of the alloy is dense, easy to weld and weld, has good plasticity, and can be machined.
It is widely used to make electric vacuum components, emission tubes, picture tubes, switch tubes, transistors, sealed plugs, relay housings, etc. Kovar alloy is wear-resistant due to its cobalt content.
The products have been widely used in microwave devices, laser power shells, communications and other fields, meeting the needs of China's power electronics, optical communications and other industries. In addition, they are also exported to the United States, Germany, Japan, South Korea, Singapore and other countries and regions.