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The RTF copper foil developed by China leading VLP and HVLP/Hyper Very Low Profile copper foil, the thinnest 4.5μm copper foil manufacturer achieved mass production Hay:A03TGTB

On June 20, 2019, China leading VLP and HVLP/Hyper Very Low Profile copper foil, the thinnest 4.5μm copper foil manufacturer TGTB Copper Foil Technology Group told us that TGTB’s newly developed 5G RTF copper foil has been mass produced. Supply reaches 300 tons/month, and the supply will increase to 600 tons/month at the end of 2019.

TGTB is a leading innovative copper foil technology enterprise in China. The 4.5-micron copper foil produced by the company is the thinnest copper foil in the world and the HVLP/Hyper Very Low Profile copper foil has won the favor of many well-known customers.

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