Despite the global downturn, ABF board factories continue to expand production due to the demand for high computing power and advanced packaging.
According to the data cited by the Institute of Obstetrics of Taiwan, China Institute of Industry Research by the Printed Circuit Board Association (TPCA), in 2022, the world's top ten plate manufacturers will be highly concentrated. Among the world's top five manufacturers, Xinxing and Nandian will respectively rank first and second, and the Japanese manufacturer Ibiden will rank third.
According to TPCA statistics, the top ten carrier plate manufacturers accounted for 84.8% of the global output value, Taiwan, China, China was the largest carrier plate supplier, accounting for 38.3% of the overall output value, followed by South Korea and Japan. The three manufacturers covered 90% of the carrier plate market in total.
Specifically, the top five carrier manufacturers are Xinxing (17.7%), Nandian (10.3%), Nissan Ibiden (9.7%), Korean SEMCO (9.1%), and Nissan Shinko (8.5%), with a total of over half of the global market share.
In addition to actively expanding BT carrier capacity, Chinese Mainland plants also began to layout medium and high level ABF carrier business. TPCA pointed out that according to the current progress of Shennan, Xingsen and other manufacturers, it is estimated that trial production should start in the fourth quarter of 2023.
In recent years, under the scientific and technological conflict between China and the United States, Chinese Mainland is increasing its support for its domestic semiconductor related industries in order to break through the semiconductor technology restrictions of the United States. The development of Chinese Mainland's carrier plate industry really has the opportunity to break through the restrictions and expand its global footprint.
TPCA continues to be optimistic that the ABF carrier board will be in a state of oversupply before 2025. Due to the continued weakness of the consumer market, the inventory depletion process will be delayed, which is unfavorable for the recovery of the BT carrier board. It is estimated that the output value will shrink by 9% in 2023, reaching approximately 7.44 billion US dollars; The demand for AI high computing power and advanced chiplet packaging technology have been the main factors driving the growth of the ABF board market in recent years, thus driving board factories to increase capital expenditure and actively expand production capacity.