The global most powerful information hub of high performance & advanced materials, innovative technologies

to market your brand and access to the global demand and supply markets

The ultra-thin graphene heat dissipation technology developed by a Chinese company obtains a U.S. patent Hay:F03TWSQ

China’s leading supplier of electronic cooling solutions: TWSQ Thermal Management Materials Technology Group’s newly developed cooling technologies include patented aluminum fin cooling technology with thermal conduction design (new patent M541645 in Taiwan, China) and patented ultra-thin graphene Heat dissipation technology (Invention Patent I703921 in Taiwan Region / New Patent CN 211019739 U in Mainland China), and the newly added US invention patent certification on graphene heat dissipation (US invention patent US 11,051,392 B2).

Please check the message before sending