On December 19th, Japan Toray Industries Co., Ltd. released a polyphenylene sulfide (PPS) film, which maintains excellent dielectric properties and chemical stability of PPS polymers. Its heat resistance has also been increased by 40 ° C.
This film can be used in flexible printed circuits such as 5G for fast data transfer, and has two advantages. One is to reduce the transmission loss of high-frequency communication equipment; the other is to help stabilize high-speed communication between temperature and humidity spectrum. .
At present, practical liquid crystal polymer (LCP) films have been developed on the market as flexible printed circuit board materials required for 5G. However, the dielectric properties of this film reduce the transmission loss in high frequency bands, and this film can also produce thermal resistance when soldering circuit boards.
Generally speaking, PPS films have excellent flame retardancy and chemical resistance, and at the same time match or exceed the dielectric properties of LCP films. The effect of extreme temperature and humidity on the PPS film is much smaller. However, the weakness of the PPS film is that it is easily deformed at high temperature, and the heat resistance is insufficient when soldering the circuit board.
In order to overcome the shortcomings of PPS, Toray has developed a proprietary technology to control the crystal structure of polyphenylene sulfide thin film, while maintaining the outstanding performance of PPS, and significantly improving its heat resistance. Tested at 250 ° C, the new PPS film developed by Toray did not deform. After increasing the thermal resistance, it can be used in the existing circuit board processing equipment.
Toray has completed the pilot test of this new PPS film and is expected to establish an industrial production facility in fiscal 2020 to serve the rapidly expanding 5G field.