In industry, a heat sink refers to a material whose temperature does not change with the amount of heat transferred to it. In layman's terms, it is a miniature heat sink, a device used to cool chips. Tungsten copper heat sink is a heat sink made of tungsten copper composite material.
The tungsten copper heat sink material is a composite material of tungsten and copper, which not only has the low expansion characteristics of tungsten, but also the high thermal conductivity of copper. In other words, the thermal expansion coefficient and thermal conductivity of the tungsten copper heat sink can be designed by adjusting the composition of the material, so as to form a good thermal expansion match with the semiconductor material, and be applied to semiconductor high-power packaging. Of course, tungsten copper composite materials can also form a good thermal expansion match with ceramic materials and metal materials, so that they can be used in industries such as optical communications.