As terminal brands increasingly pursue the diversification of application scenarios, functions including biometrics, AR imaging, 3D modeling, distance measurement and other functions have gradually appeared in the field of vision of consumers, and many of the scenarios mentioned above cannot be separated from 3D Technical support. Therefore, we see that related technologies have been widely adopted in many fields represented by consumer electronics in recent years.
A few days ago, China’s leading touch and optical fingerprint recognition chip technology company, BJZY was invited to participate in the 4th Biometric Technology and Application Forum in 2020". Liu Haolei, ToF Marketing Director of BJZY Sensor Business Unit, told the company’s 3D ToF in an interview with the media And the development results of ultrasonic technology to share.
The new height of fingerprint recognition
Although the field of biometrics has undergone several years of development and various solutions have emerged, it is undeniable that fingerprint recognition has the highest penetration rate. However, in the process of industrial development, fingerprint recognition technology has also begun to transition from the initial capacitive fingerprint recognition to fingerprint recognition under the optical screen, and continues to show a trend of technological upgrading.
Hay Think mentioned in previous reports that some supply chain manufacturers revealed that Apple, known as the "weathervane", has been continuously developing ultrasonic fingerprint recognition products.
It is understood that compared to the capacitive and optical solutions, the ultrasonic solution has the characteristics of not being restricted by materials, and can penetrate glass, metal or plastic. In terms of recognition, ultrasonic technology can directly reach the user's dermis, which has higher security; in addition, it can further enhance the aesthetics of the end product.
Liu Haolei introduced to Hay Think that BJZY has currently launched the integrated MEMS ultrasonic fingerprint chip GSL8165. This ultrasonic fingerprint chip is based on the original single silicon MEMS structure of the CMOS process, with simple structure and easy process realization; and adopts Beam-forming multi-point At the same time, the technology of sending and focusing further increases the penetration ability of ultrasound, making the recognition performance better. At the same time, the system algorithm level uses edge AI and neural network calculations to further enhance its security.
Liu Haolei also said: "For the development of mobile phone fingerprint unlocking products, although we have developed from the earliest single-point unlocking to the current stage unlocking, for us, the ultimate goal of fingerprint unlocking is "blind solution". Said, users only need to pick up the phone to complete the unlocking action."
It is reported that the large-area TFT under-screen fingerprint sensor GSL7253 launched by BJZY, with an area of 30mm*20mm, has a high QE of 80%, is ultra-thin (only 0.3mm thick), and COG packaging technology, which can support unlocking at any position, blind solution, and support Two-finger/multi-fingerprint unlocking.
In addition to the fingerprint recognition technology mentioned above, 3D ToF has been one of the technical directions that have attracted great attention in the biometric field in the past two years.
GD ToF solution
BJZY's ToF solution adopts a special process, has a higher QE (photoelectric conversion rate), can effectively reduce power consumption and system cost, and can support both the 1350nm-1550nm long waveband and the 940nm waveband at the same time, which is excellent in outdoor Performance meets the needs of the future screen direction. In addition, because of its longer wavelength, the energy is weaker, and the safety of the human eye is more guaranteed.
In fact, speaking of ToF, it should be familiar to many people. At present, the mainstream ToF solutions are divided into two types: dToF and iToF. The dToF solution is only adopted by Apple, while iToF is favored by many Android brands. In fact, these two types of schemes can be said to have their own advantages and disadvantages.
In this regard, Liu Haolei also pointed out: “In our opinion, iToF and dToF will be parallel for a period of time. Although the resolution is a shortcoming of dToF, in the long run, we believe that dToF has a lot of room for growth because of the dToF solution. Not long after its launch, the industry chain is not mature, which also means that it has a lot of room for improvement."
Regardless of the upgrade of product parameters, the development of application scenarios is also a common issue for this technology. At this stage, the biggest demand for ToF technology lies in smart phone products, mainly focusing on the two scenarios of face recognition and AR imaging. Due to the lack of application scenarios, it has greatly increased the difficulty of popularizing this technology.
When talking about the scenario development direction of this technology, Liu Haolei also said: "We believe that the potential of ToF needs to be promoted by industry chain ecological partners. It is certain that this technology will have higher and higher requirements for hardware. For example, In the dToF solution, if the resolution can be significantly improved, the application of products will become more and more extensive."