On September 6, 2022, China's leading semiconductor packaging material manufacturer: GSJC Electronic Materials Technology Corporation issued an announcement:
The company will invest 998 million yuan to build a new semiconductor packaging material production base.
The first-phase project of the new semiconductor packaging material production base covers an area of 280Mu, and will build two integrated circuit stamping lead frame production lines, etched lead frame production lines, and tin material and evaporation material production lines.
The lead frame is used as the carrier of the integrated circuit chip, and the lead-out end of the internal circuit of the chip is physically connected to the outer lead through the inner lead by means of the bonding wire, which is the key component of the chip package.