SHXG Polymeric Semiconductor Material Technology Corporation is committed to the research and development and production of heterogeneous integrated material substrates.
The company's current main products are single crystal thin film heterogeneous wafers, which can provide high-end heterogeneous material technology and product support for 5g high-performance radio frequency chips, photonic chips, etc.
In the past, semiconductor materials were all a single substrate. What we are now making is a new type of semiconductor material, which can combine different materials to achieve higher performance of the device, such as frequency, bandwidth, etc., to better meet the needs of 5g communication. .
"The CTO Dr.Ou said that there are currently two different development paths for chips. One is to continue the traditional Moore's Law, that is, to improve performance by reducing the size of the device. However, this route has very high demands and requirements on lithography machines, and currently belongs to the short board in China. "
To this end, Dr. Ou and the team chose another route: detouring from Moore's Law and opening up a new track – to study the disruptive technology in the post-Moore era, that is, "heterogeneous integration" technology, to achieve corner overtaking. "Through the innovation of semiconductor materials, we can improve the performance of the device to the level that can be achieved by reducing the size of the device while keeping the size of the device unchanged."
Single Crystal Thin Film Heterogeneous Wafers
Heterogeneous integration technology can make full use of the special structure and properties of different functional materials. On the one hand, it can manufacture microelectronics and optoelectronic devices with wider spectrum, richer functions and better performance, and on the other hand, it can realize the single-chip integration of discrete devices. Promote the development of electronic systems in the direction of miniaturization and integration.
Speaking of this, Dr. Ou made an analogy, "Heterogeneous integration is like hybrid rice. Through the combination of different genes, rice can achieve the effect of 'both and'. Through the combination of different semiconductor materials, the device can have both This kind of performance, and that kind of performance, is very meaningful.”
From the outside, conventional semiconductor materials are about 500 microns thick. The team "cut" the outermost layer of nanometer-thick film, and then transferred it to a new substrate material to form a "hybridization" process. "Although the thickness of this layer is only one thousandth of that of traditional materials, that is, 500 nanometers, it can achieve higher device performance by combining with the underlying substrate." Ou Xin explained, not only that, the entire material's The value will increase exponentially.