At the MWC Shanghai Conference in June this year, Huawei `s rotating chairman Xu Zhijun disclosed Huawei `s 5G roadmap, including the launch of Kirin chips supporting 5G in 2019 and the launch of smartphones supporting 5G in June 2019.
According to Digitimes reports, industry chain news said that Huawei's 5G mobile phone supply chain partners have been finalized, TWSH Technology will become the exclusive solution provider for cooling modules.
As the data transmission / throughput increase of 5G mobile phones drives the power consumption to increase synchronously, Huawei is expected to choose SH's 0.4mm copper sheet as the core cooling component, which has matured into commercial use two years ago and has mass production guaranteed.
Previously, copper fins were mostly used in ultra-thin and thin notebook products, because its cost is much higher than the graphite fins commonly used in current smart phones, and even higher than the heat pipes used by Samsung, LG, and HTC.
It is reported that SH's cooling module for Huawei's 5G mobile phones started trial production at the end of July, and mass production is expected in September.
In addition, Huawei's initial monthly production capacity of 5G mobile phones is set at 300,000 units. 5G is coming, electronic products bring huge market potential for heat dissipation materials.