ZJHF Electronic Substrate Co., Ltd.'s main business is the R & D, production and sales of angular silicon powder and spherical silicon powder, of which spherical silicon powder accounts for the vast majority.
Capacity: In 2016, it has the capacity to produce 4,600 tons of spherical silicon powder (the global market share is less than 4%), and plans to expand the capacity to 12,000 tons in the future.
Main customers:
ZJHF electronic products are mainly used in integrated circuit packaging materials (plastic packaging materials) and general electrical devices, insulation casting epoxy potting materials for high-voltage electrical appliances, and packaging transistors, diodes and discrete devices, mainly sold to such as Sumitomo Bakelite , Taiwan's Code, Hitachi Chemicals, Germany's Henkel, Matsushita Electric and other internationally renowned epoxy plastic sealant manufacturers and enterprises established by these manufacturers in China, and some products are sold to domestic customers engaged in electrical equipment manufacturing and other industries.
Spherical silicon powder market prospect
Spherical silicon powder is mainly used in large-scale integrated circuit packaging. It is also used in high-tech fields such as aviation, aerospace, fine chemicals, rewritable optical discs, large-area electronic substrates, special ceramics and daily cosmetics, and has a broad market prospect.
With the rapid development of China's microelectronics industry, large-scale and ultra-large-scale integrated circuits have increasingly higher requirements for packaging materials, not only for their ultra-fineness, but also for their high purity, especially for the spherical shape of particle shapes.
Spherical silicon powder can reach micron level, submicron level and nanometer level in particle size. It has a series of excellent characteristics such as high dielectric, high heat resistance, low expansion, etc. It is an epoxy plastic sealing material for large-scale integrated circuit packaging materials and copper clad laminates. The lack of fillers accounted for 70% to 90% of the molding compound and 20% to 30% of the mixed casting ratio of copper clad laminates. It can also be used in high-tech fields such as aerospace, fine chemicals, large-area electronic substrates, and special ceramics.
According to the development plan of China's semiconductor integrated circuits and devices, in the next 4-5 years, China's demand for spherical silicon powder will reach more than 100,000 tons. At present, the domestic consumption of spherical silicon powder for ultra-large-scale integrated circuit packaging materials has exceeded 3000 tons.