On September 2, 2018, China's first single crystal nano-copper bonding wire intelligent processing production line officially began commercial production in ZJZW. This indicates that the key material for chip manufacturing—single-crystal nano-copper bonding wire has achieved domestic mass production.
Single crystal nano-copper bonding wire, the diameter of the finished product is 13 microns, which is about one-tenth thinner of a human hair. It is a key material for integrated circuit semiconductor packaging. In the past, most of China's key semiconductor materials came from imports, and the raw materials were precious metals gold or silver, which were expensive, which became one of the "bottleneck" materials restricting Chinese chip production.
This technological breakthrough of single-crystal nano-copper has realized the use of new copper-based materials to replace other precious metals in China, greatly reducing costs and reducing prices by nearly 50% compared with similar foreign products.
This raw material is mainly used in chips in the fields of communications, automobiles, and medical and industrial control. At present, the production base has an annual production capacity of 5 million reels. After the production capacity is reached, it will meet about 10% of the use needs of domestic related industries, and contribute to the goal of "breaking the blockade and replacing imports" of China's integrated circuits.