On December 20, 2019, JSJC Electronic Materials Technology Co., Ltd. held a mass production ceremony for a 5G high-frequency and high-speed flexible copper clad laminate project.
This also indicates that JSJC's 5G high-frequency and high-speed flexible copper clad laminate project has entered the production stage.
The new project of JSJC ultra-thin high-frequency flexible copper clad laminate is planned to have a total investment of 800 million yuan. It was officially started in August 2018, and a new modern factory building of 50,000 square meters will be officially put into operation in December 2019. After the project is put into production, it can achieve an annual output of 15 million square meters of ultra-thin high-frequency flexible copper-clad laminates.
Huang Nankun, general manager of JSJC, said that the company has the core technology of high-frequency and high-speed flexible copper clad laminates for 5G. The self-made adhesive material is sufficient to replace the old technology. At present, it is mainly used to make printed circuit boards (PCBs). Base stations, military radars, semiconductors, medical and health, new energy vehicles, unmanned vehicles, artificial intelligence, communications, smart phones, smart cities and other industries.
JSJC has applied for 9 core patents for high-frequency materials. The products will be supplied to many well-known enterprises such as Huawei, OPPO, Xiaomi, Sony, Apple, BYD and so on.