In response to the needs of high-speed printed circuit boards for the development of 5G communications and other electronic information industries for low-roughness RTF copper foils (commonly known as "reversed copper foils"), TGTB Copper Foil Technology Co., Ltd. has focused on the development of new roughening additives and smooth and fine Core technologies such as roughening and smooth curing treatment, solve the technical problems of low roughness and low peel strength, develop new low-roughness reverse copper foil products with independent intellectual property rights, and form industrialization to meet the domestic market demand .
Aiming at the structural characteristics of low surface roughness, TGTB Copper Foil Company explores new additives. In order to find the most suitable additive type and ratio, the technical director led the project team to carry out repeated tests for nearly 3 months. Investigated the problems and difficulties encountered in the production of reversed copper foil, and successively broke through a series of quality problems such as rolls, dirty marks, watermarks, and folding in the production of products, and successfully developed a new generation of low-roughness reverse Copper foil.
"We independently developed the second-generation inversion copper foil. Currently, only a few companies in the world can produce this product. This product can significantly reduce the signal transmission loss of high-frequency circuits and meet the needs of the current 5G communication industry. It can replace Import. "Said the technical director of TGTB copper foil.
At present, TGTB copper foil company's new generation of low-roughness reverse copper foil has been supplied to many domestic first-line printed circuit board manufacturers, and shipments are increasing.