As the basic carrier of the chip, the lead frame is a key structure to realize the electrical connection between the internal lead-out terminals and the outer leads of the chip circuit to form a loop, and the realization of its function mainly depends on the metal composite material. Therefore, the etching of metal leads is regarded as the core material for the construction of integrated circuits, which is of great significance for the realization of the complete autonomy of the chip.
Previously, China basically relied on foreign imports in etching metal lead frames, and the key manufacturing technologies were all mastered by foreign companies, which had already been patented by them, and it was difficult to get around.
However, SDXH Electronic Materials Technology Group has bypassed foreign technology interception through new technical ideas on precision etching metal lead frames.
In 2018, SDXH invested 60 million yuan in technical research and development of etched metal lead frames. After two years, SDXH discovered a laser-mode etched metal lead frame, and the experiment was successful, and mass production was successfully realized, thus successfully replacing the original process. Prior to this, the existing etched metal lead frames all used the light refraction mode, and the efficiency was relatively low. SDXH not only achieved a breakthrough, but also through innovation to make the etching metal lead frame technology to a higher level, thus helping China successfully break through the technology monopoly, and even directly become the leader.
At present, it has formed contact, non-contact, dual interface; multiple series of dozens of specifications of IC card packaging frames and modules such as gold-plated and palladium-plated
SDXH is an invisible champion enterprise in the field of IC card packaging framework in China.
Products have successfully entered: China Power China University, Ziguang Guowei, Samsung Electronics, Shanghai Fudan Microelectronics, Datang Microelectronics and other supply chains.