SDYN Electronic Materials Technology Group is a high-tech enterprise specializing in the research and development, production, sales and service of bonding wires and welding materials. Its products include silver-based bonding wires, gold bonding wire, copper bonding wires, aluminum bonding wires, and chips. Welding wire, evaporation and target shooting materials, the products involve electronic packaging, semiconductor chip production and other fields.
SDYN has a global R&D team of scientific researchers, technical experts and engineers. It is the most professional bonding wire and welding material manufacturer with independent research and development capabilities in China, and it is also a new type of bonding wire such as silver-based and copper-based in China The earliest product development and promotion enterprise.
Bonded silver wire-the world's first, through the core alloying and casting process technology, has successfully replaced the gold wire in some areas, and authorized invention patents.
Chip bonding wire, the core melting and casting technology, can minimize the problem of bubbles and splashes, replacing imports.
The products mainly include silver-based bonding wires, bonding alloy wires, bonding copper wires, aluminum wires, chip bonding wires, evaporation and target shooting materials, which are used in many fields such as electronic packaging and semiconductor chip production. At present, the invention patents for "bonding silver wire" and "flexible bonding copper wire" have been obtained.
Bonded silver wire: The world's first, awarded the invention patent in 2009, the first at home and abroad, and responsible for drafting and completing the industry standard. Through the core alloying and casting technology, it has solved the problem of excessive diffusion and performance degradation of the silver-aluminum intermediate compound, and has enhanced the corrosion resistance. It has been widely used in the market.
Gold bonding wire: Based on high purity gold above 5N, professional alloy casting and processing technology, stable performance, can meet the needs of different packaging.
Copper Bonding wire: 4N high purity copper wire, 3N flexible copper wire, 2N alloy copper wire, 1N5 alloy copper wire.
Aluminum bonding wire: 4N general-purpose aluminum wire, 5N high-purity aluminum wire, corrosion-resistant aluminum wire, silicon aluminum wire.
Chip bonding wire: The core melting and casting technology can minimize the problem of bubbles and splashes, replacing imports.
Evaporation material/target material: meet the needs of customers with high purity materials above 5N, various alloys, and different shapes.