GSHY Electronic Materials Technology Group was established in 2000. The company has total assets of 680 million yuan, covers an area of 86,000 square meters, and currently employs 508 people, including 62 middle and senior professional engineers and technicians. It is China’s leading high-speed cold stamping, A semiconductor integrated circuit lead frame manufacturer integrating two optical etching processes, now a national high-tech enterprise; a provincial technological innovation demonstration enterprise; a provincial enterprise technology center; a provincial engineering research center, a provincial industrial design center, and a provincial Class-level international science and technology cooperation base, provincial-level intellectual property advantage enterprise, national semiconductor integrated circuit packaging and testing best material supplier, and national electronic information industry outstanding enterprise. , The product has successively won the second prize of the 3rd China Entrepreneurship and Innovation Competition, the 16th, 17th, and 18th National High-tech Products Fair Excellent Product Award…
GSHY has successively introduced fully automatic production lines and testing equipment from the United States, the United Kingdom, South Korea, Singapore, and Japan, integrating production, research and development, and sales. It also has two processes of mechanical stamping and chemical etching, and has a fully automatic roll-to-roll optical etching production line. Optical etching wet film electroplating, roll-to-roll plating and etching process, nickel-palladium plating process, PPF process, single-side roughening process, and visible spectrophotometric control technology are all leading domestically.
Accelerate the transformation of scientific and technological achievements through technological innovation, process innovation, management innovation, and mechanism innovation to account for 6% of sales revenue. The development of products includes DIP, SOP, SOT, SOD, SSOP, TSSOP, QFN, DFN, QFP and other series There are more than 400 varieties in 7 categories, covering all-round high, medium and low-end products. Among them, the stamping process can mass-produce varieties below 100 pins, which can meet the requirements of SOP, PDIP, PQFP, SOJ and other packaging forms. need. The etching process can meet the processing requirements of multiple varieties, thin materials (0.05-0.15mm), multiple leads (100-300PIN), small spacing (0.03), fine dimensions, and complex graphics.
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Among the top ten global semiconductor integrated circuit packaging and testing manufacturers, Taiwan ASECL, SPIL (Siliconware Precision Industries Co., Ltd), Amkor, SPIL, HT Technology, Changdian Technology, TongFu Microelectronics and other global semiconductor packaging and testing giants and Xi’an Microelectronics Technology More than 60 well-known packaging companies at home and abroad including research institute (771), Zhejiang Huayue Group…