On October 18, 2022, the project "Key Technology and Industrialization of Zirconia Toughened Alumina Ceramic Substrate for IGBT Packaging" jointly declared by HNTM Advanced Ceramic Technology Corporation, ZZZC Ceramic Substrate Technology Corporation and Tsinghua University won the second prize of the 2022 Provincial Science and Technology Progress Award.
Zirconia toughened alumina (ZTA) is a kind of excellent energy composite with high strength and high toughness, which is prepared by injecting zirconia into alumina and compounding the two materials in a certain proportion.
The toughness of zirconia toughened alumina substrate is better than that of traditional alumina ceramic substrate, and the shock resistance and thermal shock resistance of copper coated alumina substrate are double that of traditional alumina substrate.
Zirconia toughened alumina substrate has obvious advantages in electric vehicles, military equipment and other circuit boards that need to be used in bumpy vibration and rapid cooling and heating conditions, as well as IGBT power semiconductor packaging applications.
In this project, the design scheme of ZTA's optimal particle size grading and zirconia's optimal volume fraction based on the cubic compact packing model is proposed, so as to master the advanced technology, improve the surface quality and improve the yield, solve the problems of large discreteness of product quality and unstable performance, and make the product quality reach the international advanced level.