At the end of September, the groundbreaking ceremony of the fourth phase of the GDSY Electronic Materials Technology Group in Dongguan opened.
GDSY Dongcheng Factory (Phase IV) invested 2.28 billion yuan, the project includes the Dongcheng Factory 5G application field high-speed and high-density printed circuit board expansion and upgrade project and R&D center construction project.
The project is invested by GDSY and is located in the existing factory area of Shengyi Electronics in Tongsha Technology Industrial Park, Dongcheng. It consists of two parts, the fourth phase of the intelligent production base and the 5G application field circuit board research and development building, which will serve as the group headquarters. The project is mainly engaged in the development and production of 5G high-end circuit boards.
The products will be widely used in 5G base station construction, network transmission and storage, consumer electronics, industrial control and other application fields. The product structure belongs to the relatively high-end PCB products in the company's product line.
About GDSY
GDSY Electronic Materials Technology Group, is a leading manufacturer of high-quality high-density, multilayer printed circuit board, It has rich experience over more than 30-year's growth and expansion.
GDSY is the world's second largest manufacturer of high-quality, high-density, multilayer printed circuit boards.
GDSY covers 60,000 square meters, over 3,000 employees, professional in high precision, high density and high quality printed circuit boards. Take advantage in multilayer PCBs which widely used in communication, networking, power supply, instrument, automotive electrics and other fields, marketing in North America, Europe and Asia-Pacific countries.
"High Quanlity" is always the DNA in the management system, and to provide satisfying product and service is the goal we're persuing. The best quality and leading market position is based on total quality management and well performed quality insurance under ISO9001, ISO14001 , ISO/TS16949, OHSAS18001, ISO/IEC27001 as well as technical development drives.
Products
Line Card
Embedded Coin PCB
Press-fit Coin PCB
Large Size Line Card
Sequential-lam N+N
Step Gold Finger Boad
Backplane
Dual-via Backplane
High Speed Backplane
High Layer-count & Large Size Backplane
HDI
HDI with Stacked-via
Sequential HDI
Rigid-Flex PCB
HDI Rigid-flex Board
Rigid-flex Board