FJSS Advanced Materials Technology Corporation is the leading manufacturer engaged in the R&D and manufacturing of preforming soldering lug and welding wire in the field of electronic packaging.
The company and Nanjing University of Aeronautics and Astronautics have jointly established "United laboratory of electronic packaging materials". Escorted by colleges and universities, the talents are introduced to carry out university-industry cooperation and continuously improve R & D capabilities.
Committed to the application of new solder in high reliability semiconductor packaging, optoelectronic packaging and other fields, the company has achieved a number of invention patents, and utility model patents. The processing accuracy of alloy wire reaches to 15 microns, and thickness of alloy solder to 20 microns at world advanced level, which have been applied to the Temple of Heaven II and Shenzhou 11 manned spacecraft, AWACS, UAV, Radar, Missile Guidance, Infrared Thermal Imagers and other high-end electronic packaging components.
Since 2007, the company's R & D team has independently developed the rolling of high-brittle AuSn20 solder preform and precision stamping forming process, as the genuine pioneer and leader in this field at home. After nearly 3 years of technical research, the team has successfully mastered the material processing technology, and broken through the foreign technique monopoly. Since 2011, the team has developed the precision machining of Au-Ge and Au-Si solder preform. The three enterprise product standards "Gold solder", "Silver solder" and "Indium solder" achieved by Source fill a domestic gap in this field.
The company's main products include high-brittle AuSn20, AuGe12, AuSi3.15 and other precious metal solder preform. In addition, the company can also provide customers with Ag-based, In-based, Bi-based, Sb-based and Pb- based solder preform in wire and strips, which are mainly used in microelectronics, optoelectronics, high-power LED, high-power microwave devices, ceramic packaging and other fields, especially in military, aerospace and other packaging of high reliability.
Thanks to efficient and high-level mold design and processing team, the company is capable of rapidly processing high-precision molds (average 5-7 working days) by customer requirements, for the solder preform in various sizes (the minimum thickness of 10μm) .