HBZC Electronic Ceramic Technology Group is a high-tech enterprise specializing in the research and development, production and sales of electronic ceramic products. It is committed to becoming a world-class supplier of electronic ceramic products and providing customers with innovative, high-quality and competitive electronic ceramic products.
The company's main products include ceramic housings for optical communication devices, ceramic housings for wireless power devices, ceramic housings for infrared detectors, ceramic housings for high-power lasers, ceramic housings for acoustic watch crystals, ceramic housings for 3D light sensor modules, ceramic housings for 5G communication terminal modules, and nitrogen Aluminum ceramic substrates, ceramic components, integrated heaters, etc., are widely used in optical communications, wireless communications, industrial lasers, consumer electronics, automotive electronics and other fields. The company's electronic ceramic housing products are an important bridge for the connection of internal chips and external circuits in high-end semiconductor components, and have an important role and influence on the performance of semiconductor components.
Products
Electronic ceramic products for communication
Optical communication device ceramic housing
Infrared detector ceramic housing
Wireless power device ceramic housing
Electronic ceramic products for industrial lasers
Consumer electronics ceramic products
Acoustic watch crystal oscillator ceramic shell
3D light sensor module ceramic housing
Ceramic shell for 5G communication
Aluminum nitride ceramic substrate
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The technical advantages of HBZC are mainly embodied in new electronic ceramic materials, semiconductor enclosure simulation design, and production technology.
In terms of materials, HBZC independently masters three ceramic systems, including 90% alumina ceramics, 95% alumina ceramics and aluminum nitride ceramics, as well as matching metallization systems.
In terms of design, the company has advanced design methods and design software platforms that can optimize the design of ceramic housing structure, wiring, electricity, heat, and reliability. The company has been able to design and develop 400G optical communication device housings, which is equivalent to the technical level of similar foreign products; it has the ability to simulate the thermodynamic reliability of ceramic materials such as alumina and aluminum nitride and new metal sealing, which can meet the heat dissipation and heat dissipation of new generation wireless power device housing Reliability requirements; to achieve air-tight and high-lead-strength structure design, the developed high-end fiber-coupled semiconductor laser package housing meets user requirements.
In terms of process technology, the company has a full set of multilayer ceramic shell manufacturing technologies, including raw material preparation, casting, punching and cavity punching, metal printing, lamination, hot cutting, sintering, nickel plating, brazing, gold plating and other technologies. The company has established a complete aluminum oxide ceramic and aluminum nitride ceramic processing technology platform. It has an aluminum oxide multilayer ceramic process based on tape casting, a high temperature thick film metalization process based on thick film printing, and a high temperature solder The main brazing assembly process and the nickel plating and gold plating processes based on electroplating and chemical plating.