Corning Corporation and Shanghai Xufu Semiconductor Electronics Co., Ltd. announced today that the two parties have signed a sales agency agreement for semiconductor glass substrates in the Chinese market. The agreement will help connect Corning's glass substrate products with China's potential customer base, and will also help Corning expand its presence in this fast-growing market.
Corning's semiconductor glass substrates can be used for temporary bonding in semiconductor packaging processes, such as advanced semiconductor packaging processes such as silicon wafer thinning and fan-out packaging. These processes are key to producing smaller and faster computer chips for consumer electronics, automobiles and other connected devices.
Xufu Semiconductor Electronics is committed to providing semiconductor components and professional technical support, and supplying materials, instruments and engineering services to advanced semiconductor factories worldwide. Asahi Semiconductor has established operations and operations in mainland China, Taiwan and Singapore, and has successfully established an extensive customer network in the Asia-Pacific region over the past decades.
Dave Velasquez, vice president and general manager of Corning Precision Glass Solutions, said: "We are very pleased to work with Xufu Semiconductor to better support Chinese customers and to respond to the rapidly growing industry trend in the domestic semiconductor glass application market."
Velasquez also said, "Corning has been providing glass solutions to world-leading semiconductor customers for many years, and Xufu Semiconductor Electronics has established a foothold in the Chinese semiconductor industry supply chain. We hope that through the joint efforts of both parties, we will greatly expand our quality Coverage of glass products in leading semiconductor companies. "
Today, one of the challenges faced by advanced chip manufacturers is how to minimize wafer deformation during the semiconductor packaging process, thereby improving the yield of chip packaging. To do this, they must find a glass carrier that matches the coefficient of thermal expansion (CTE) of their packaging process. Corning glass carrier boards provide a variety of thermal expansion coefficients, and can achieve a small number of orders and fast delivery to meet customer needs.
Corning glass substrates are one of a series of Corning precision glass solutions designed to meet the emerging needs for glass in the microelectronics industry. This series of products provides customers with world-leading one-stop services, including proprietary glass and ceramic manufacturing platforms, finishing processes, bonding processes, premier measurement capabilities, automatic laser glass cutting technology, and optical design capabilities.