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Dow Attends CES Asia 2018, Introduces New Silicone Thermal Gel, Provides Highly Reliable Thermal Management Performance for Smartphone Components

Shanghai, June 13, 2018-Dow's High-Performance Silicone Business Unit, a global leader in silicones, silicon-based technology and innovation, unveiled at CES Asia 2018 (Booth No .: # N1 1046 ), Exhibiting its new Taoxi ™ TC-3015 silicone thermal gel for thermal management of smartphone components, replacing the original Dow Corning ™ label with the new brand Taoxi ™. This new product forms a thermally conductive gel after curing, which enables efficient heat dissipation of the chipset and also has excellent wettability, which ensures low Rc (contact resistance) for thermal management, even in integrated circuits (IC) and central processing units. (CPU) and other parts of the smartphone that generate the most heat will not form hot spots. It is worth noting that the material can be easily peeled without residue for heavy industry, which is a great advantage for consumer equipment. As a printable or non-essential product, Taoxi ™ TC-3015 Silicone Thermal Gel can be integrated into automated processes without spending too much time on finished thermal pads.

Rogier Reinders, director of global marketing for circuit boards and systems assembly at the Dow Consumer Solutions Business Unit, said: "To cope with the challenges of thermal management, smartphone customers in China and around the world are seeking new solutions. We are developing this new type of thermally conductive organic Silicon is to support it. Taoxi ™ TC-3015 Silicone Thermal Gel provides excellent thermal management balance, facilitates heavy industry and streamlines processes. We expect this material to set a new standard for thermal management, replacing impact Traditional bulky thermal pads with design freedom. We've partnered with a leading smartphone manufacturer to meet future heat dissipation requirements for thinner, smaller, and higher performance devices. "

It is expected that by 2022, the fast-growing smartphone industry shipments will reach 2.1 billion units. With the increase of equipment functions and the increasing requirements of end customers for processing speed, thermal management is becoming more and more important for performance improvement and service life extension. Another influencing factor is the advent of 5G wireless networks. By then, the processor will be more powerful, the data processing capacity will be higher, and the mobile phone will face greater heat dissipation pressure.

Streamline processes and improve performance

C.H. Lee, Director of Global Technology Service and Development (TS & D), Circuit Board and System Assembly, Dow Consumer Products Solutions Business Unit, introduces that Dow ™ TC-3015 Silicone Thermal Gel can be processed in a variety of ways. He said: "First, the thermally conductive gel uses a one-component formulation and does not require mixing. Second, the material can be cured at room temperature or by the chip's own heat, which does not require a separate curing process, which helps improve production efficiency. Customers and consumers need faster cures, and they can put this material at a high temperature of 150 ° C. "

DOWSIL™ TC-3015 Silicone Thermally Conductive Gel is low in viscosity, has good wettability, and has low adhesion to epoxy resin and metal surfaces. It can be completely peeled off during heavy work.

The thermal conductivity of DOWSIL ™ TC-3015 silicone thermal conductive gel can be described as: TC (thermal conductivity) = 2W / mK, when the thickness of the adhesive layer (BLT) is less than 3mm, there will be no slump or crack in thermal aging. Application to smart phone components enables efficient thermal management.

The new thermally conductive gel from Dow's High Performance Silicones Division uses the new brand Dow ™. The brand is based on the newly acquired Dow Corning Silicone Technology Platform, which inherits the platform's seventy years of innovative experience and proven performance.

During the CES Asia 2018 exhibition, Dow Chemical Company scientist Wei Peng will report on the new DOWSIL™ TC-3015 silicone thermal conductive gel at 3:15 pm on June 13th. The title of the report is "For the consumer goods industry" Innovative thermal management solution. "

About Dow Performance Silicones

High Performance Silicones is a division of the Dow Consumer Solutions business unit that provides a range of performance-enhancing solutions to meet the diverse needs of customers and industries worldwide. From transportation and lighting to construction and chemical manufacturing, Dow's High Performance Silicones business helps our customers solve their most challenging problems. As a global leader in innovation and silicon-based technology, we are committed to bringing new solutions to the market, providing customers with more help, and continuously improving the lives of consumers worldwide.

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