TC-3040 thermal gel developed by Dow Corning and IBM has won the 2016 R & D100 Award. This product is a silicon-based thermal interface material (TIM-1) for thermal management that improves the performance stability of advanced semiconductor chip applications.
Dow Corning TC-3040 Thermal Gel is a one-component curable thermal interface material that is used to improve heat dissipation between IC chips and heat sinks. This advanced gel has excellent thermal management capabilities and thermal conductivity that is almost twice that of other industry standard thermal interface materials. This product also has the advantages of both low modulus and high elongation, thereby enhancing the ability to relieve stress.
At the same time, it also has excellent wetting performance, so as to ensure good contact between the chip and the cover, and can adapt to high filler volume and improve thermal performance. With this material, thinner bonding layers can be easily achieved, and excellent chip coverage can be maintained in flip chip applications.
"The R & D 100 is a highly respected award in the international science and technology field. The competitors are very innovative. We are very honored to receive the TC-3040 thermal gel." Andrew Ho, director of global marketing for Dow Corning Semiconductor Packaging Materials, said: "Now advanced The problem of semiconductor devices being damaged due to heat causes semiconductor packaging companies to face tremendous pressure in thermal management. We believe that our breakthrough products such as powerful silicone and new proprietary filler technology can bring significant advantages to semiconductor packaging companies. "
The R & D100 Awards began in 1963, and are designed to recognize the revolutionary technologies that have been introduced to the market. Each year, the top technology products are selected and praised. It is known as the "Innovation Oscar" in the technology industry. Previous award-winning technologies include: complex test equipment, new innovative materials, chemical breakthrough technologies, biomedical products, consumer products and high-performance physical technology products across industries, as well as research sponsored by academic groups and governments.