SZDB Technology Co. Ltd (Danbond) is a listed company in Shenzhen Stock Exchange with an investment of 180 million RMB. It has been specializing in R & D and manufacturing of flexible circuit and polyimide films materials. To date, SZDB has developed a national R & D center for flexible circuit and its materials, and is the biggest supplier starting from design, manufacturing, to service of flexible materials, encapsulation for flexible circuit board, and its related products.
SZDB has its own intellectual rights, including the core technology from manufacturing flexible material, encapsulating flexible circuit to encapsulating chip. It provides the chain service from design, manufacturing, service and solutions for encapsulation. Our main products include flexible FCCL, high-intensity FPC , COF circuit for chips encapsulation, encapsulation products, as well as the encapsulation-related heat curing adhesive and micro adhesive glue film. Those products can be used in high-tech end products, such as in commercial electronics, medical device, special computer, digital display, high-tech equipping industry, national defense, military, and airspace industry.
Products
FCCL single and double sides polyimide films substrates
Product Features: resistant to bending, corrosion resistance, high temperature resistance, aging resistance, indeed peel strength, tensile strength, good insulation properties, dimensional stability
Application: LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.
COF flexible encapsulation substrate
COF flexible printed circuit board package substrate as an important high-end products in the branch of products, means not mounted together on the chip, the components of the package type flexible substrates. The chip encapsulation process, plays bearing chips, circuit communication, the role of the insulating support, in particular play a physical protection to the chip, to submit signaling rate, signal fidelity, impedance matching, stress relaxation, heat moisture effect. In addition, COF flexible package substrate having a wiring density, light weight, thin , folding, bending, torsion, etc., is a new product, is conducive to the use of advanced packaging technology and development.
COF flexible encapsulation substrate
COF flexible printed circuit board package substrate as an important high-end products in the branch of products, means not mounted together on the chip, the components of the package type flexible substrates. The chip encapsulation process, plays bearing chips, circuit communication, the role of the insulating support, in particular play a physical protection to the chip, to submit signaling rate, signal fidelity, impedance matching, stress relaxation, heat moisture effect. In addition, COF flexible package substrate having a wiring density, light weight, thin , folding, bending, torsion, etc., is a new product, is conducive to the use of advanced packaging technology and development.
FPC flexible circuits
FPC Flexible Printed Circuit Board is the abbreviation of the flexible printed circuit board that is connected to the substrate for electronic parts and electronics for signal transmission medium, as an important category of printed circuit, in 2009 the output value of the global share of global print FPC control circuit output value 16.1%. Compared with the rigid printed circuit boards, flexible printed circuit has the following advantages:
① light, thin, short, small, flexible structure, can be bent, curled, folded, and three-dimensional assembly, adapter can replace a lot of parts, easy to use maximum available space, making electronic products become more slim in appearance, Widely used has a small, lightweight and mobile requirements of all kinds of electronic products;
② high heat resistance, can produce higher density and finer pitch products to meet the high density interconnect between the components and the high stability requirements, so that a larger increase the quality of the signal output;
③ can be wound transfer roller processing methods (Roll-to-Roll), easily automated, mass production, improve production efficiency.