Due to the rapid replacement of smart mobile devices, consumer demand for device diversification has increased. In recent years, electronic devices have become thinner and shorter, and the power requirements of components such as CPUs and GPUs have become greater and greater, and the operating temperature has increased significantly compared to before. However, high-temperature operation will affect the stability, service life, and reliability of electronic components. It is very important to find materials with excellent thermal conductivity.
Graphene, as one of the most widely studied nanomaterials in the world, has excellent thermal conductivity and thermal conductivity between 3500-5300W / mK. If graphene thermal conductivity is the research direction for effective thermal management of electronic components, is it feasible? This scenario has proved to be true.
Recently, China’s graphene nanosilver composite flexible transparent conductive film, graphene far-infrared flexible heating module and graphene materials manufacturer HFWJ Graphene Technology Co., Ltd., its carbon materials team and collaborators from the Materials Engineering Research Institute have prepared Graphene paper’s high-performance thermal interface material can effectively solve the bottleneck problem that the thermal interface material needs to take into account both the out-of-plane high thermal conductivity and good compressibility. This method has been widely used in thermal management of various electronic devices. However, the low out-of-plane thermal conductivity of graphene paper limits its use as a thermal interface material.
Some people may wonder why graphene paper can be used for thermal management of electronic equipment? Researchers have done a lot of experiments to confirm this. First, silicon oxide nanoparticles are embedded in the graphene layer in advance, and a carbon heat source reduction reaction is performed, so that silicon carbide nanowires with good thermal conductivity are grown in situ between the graphene sheets. Because the interface of graphene / carbon nanosilicon nanowires is a carbon-silicon covalent bond, under the packaging pressure of 75psi, the out-of-plane thermal conductivity of GHP is increased by three times compared to graphene paper, which is also higher than that of common commercial Thermal interface materials, such as thermal silicone pads, thermal greases, and thermal gels. Therefore, graphene paper as a thermal management interface material has better thermal stability and adaptability to operating temperature.
Solving the thermal management problems of electronic equipment is actually to satisfy the consumer experience and improve the high temperature of electronic equipment. Nowadays, it is a great progress for human beings to overcome this problem by scientific researchers. As an indispensable part of human life, electronic equipment solves its problems, which actually facilitates our lives.