The “Key Preparation and Processing Technology of High-performance Copper-based/Silver-based Precision Wire” project has developed hot-type horizontal continuous casting, cold-type vertical continuous casting, multi-pass continuous drawing, and direct coating of green halogen-free surface with independent intellectual property rights. Core preparation and processing technologies such as plating solve the common technical problems of copper-based/silver-based wire rod directional solidification structure and ultra-fine and ultra-precision dimensional stability control. It is mainly used in the urgently needed high-performance bonding wires, high-fidelity audio and video in key areas The development of products such as cables and high-reliability connectors and the realization of industrialization will break the situation of relying on foreign imports.
The technology is developed by a joint R&D team established by China's leading alloy precision wire manufacturer: HNYK Electronic Materials Technology Corporation, HN University of Science and Technology, LZ University of Technology and other universities.
HNYK is committed to the development and manufacturing of new materials such as bonding wires for semiconductor packaging, high-purity single crystal copper wires, and special alloy wires.