Polyimide (Polyimide, PI for short) is a type of high molecular weight polymer containing cyclic imide groups in the molecular chain, and is a special engineering plastic with excellent performance. PI is known as a "problem-solving expert" and can be processed into a variety of forms such as films, engineering plastics, fibers, matrix resins for composite materials, adhesives, and foams.
Characteristics
High temperature resistance, flame retardant, decomposition temperature of 550-600℃, long-term use temperature of 200-380℃
Excellent mechanical properties, high strength, high modulus
Good creep resistance and dimensional stability
Excellent weather resistance
preservative
Sensory characteristics
Vision: opaque, adjustable light texture
Touch: warm
Hearing: low pitch
Smell: no smell
Form
Fibers, engineering plastics, films, adhesives, foams
Classification
According to different molecular chain structures, polyimides can be divided into four types: benzene type PI, soluble PI, polyamide-imide (PAI), and polyetherimide (PEI).
Application
Thin films-flexible printed circuit board substrates, solar cell substrates, high temperature resistant electrical insulation materials, flexible display screens, gas separation films, etc.
Fiber-high-performance insulating paper, used for high-grade motor insulation; honeycomb core, used to make lightweight composite materials
Coatings-coatings for electrical insulation
Foam plastic-aerospace field, such as lightweight aircraft, high temperature resistant insulation material components, etc.
Polyimide can be used as film, resin, fiber, etc. Because of its strong designability, it has a wide range of uses.
PI film
PI film is one of the earliest commercial products of polyimide. It was originally used as a slot insulation and cable wrapping material for motors. It has now developed into one of the important raw materials in the field of electronics and electrical engineering.
PI film has the characteristics of high strength, high toughness, abrasion resistance, high and low temperature resistance, corrosion resistance, etc. It is a kind of high temperature resistant insulating material with competitive advantages. It is one of the important upstream raw materials in the two major fields of electronic and motor. It is widely used in Aerospace, electrical and electronics, semiconductor engineering, microelectronics and integrated circuits, nanomaterials, liquid crystal displays, LED packaging, precision machinery and other fields.
PI fiber
The rigid aromatic heterocyclic structure in the main chain of the PI fiber molecule makes it flame-retardant, resistant to high and low temperature, corrosion resistance and excellent mechanical properties, making it well developed and applied in the fields of protection, reinforcement, and high temperature filtration. It has begun to extend from high-tech fields such as special protection and aerospace to the field of civilian clothing.
PI foam
Polyimide foam is a foam material formed by the polymerization and foaming reaction of polyimide resin raw materials and foaming agents, foam stabilizers and other auxiliary agents.
There are many types of PI foam, density (5~400kg/m3), designable, outstanding insulation, especially with excellent resistance to high and low temperature (-250 to 450℃), radiation resistance, flame retardant, low smoke, and no The performance of harmful gas release, these unique properties are unmatched by traditional foam.
PI foam materials are increasingly used as key materials such as heat insulation, vibration reduction and noise reduction, and insulation in high-tech fields such as aerospace, defense and military industry, and microelectronics.