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Huawei’s only tin material supplier provides TE Connectivity with BGA solder balls Hay:A01YNXY

In September 2020, after a long year of performance testing and small batch supply trial, the BGA solder balls produced by YNXY Tin Industry Technology Group, the champion company in the field of "tin + indium materials" in China, welcomed TE Connectivity in September this year. The first batch of large orders, 720KK, marked YNXY's tin material BGA products to achieve a zero breakthrough, and has been recognized by the market. TE Connectivity Ltd (NYSE code TEL, has more than 20,000 employees and 16 production bases).

In April 2020, YNXY became the only official supplier of tin materials certified by Huawei in China, realizing new breakthroughs in domestic market expansion.

Tin materials and tin products

YNXY has formed 3 categories of electronic tin solder, tin anode, tin alloy, 9 series of bars, wire, powder, paste, profiled materials, pellets, balls, hemispheres, babbitt alloys, etc., with more than 1,000 specifications and varieties of products , 40 tin deep processing production lines, it is the largest tin deep processing enterprise in China with the largest production capacity. It has advanced technology such as air-cooled spray molding, high-speed centrifugal atomization, ultrasonic atomization, horizontal continuous casting, continuous casting and extrusion, automatic casting, high-speed rolling, and electric vibration separation. "

High purity indium, indium target and indium tin oxide

YNXY has established an annual production line for producing High purity indium, indium target and indium tin oxide, and has stably produced 6N and 7N high-purity indium products.

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