Recently, experts from the High-Tech Center of the Ministry of Science and Technology organized an on-site mid-term inspection in Shanghai on the key special research project "Strategic Advanced Electronic Materials" of the National Key R & D Program "Strategic Research and Demonstration Base Construction of High-Performance Alloy Conductive Materials and Micro-Fine Materials". . The expert team listened to the project team's work report and watched the production prototype and demonstration base construction on the spot. They affirmed the progress made in the project and the application results of the research and development results.
This project mainly focuses on the requirements of electronic devices and integrated circuits for conductive alloy wire foil materials, studies the microalloying and softening mechanism of ultra-pure copper alloys, and develops ultra-pure copper-silver alloy wire foils, fine gold-silver bonding wires, and nickel-chrome precision The series products of resistance alloy foils realize the large-scale production of ultra-pure copper-silver alloy materials. Up to now, the project has achieved the trial production of 90μm copper-silver alloy wire / foil by controlling the cold deformation and heat treatment conditions; the intermittently optimized continuous casting process has been used to prepare gold-silver alloy rods with excellent microstructure properties. 25μm series of gold-silver bonding wire and wire were prepared by die and XY alternate drawing method, and the preparation of gold-silver multi-layer bonding wire was realized by using cyanide-free electroplating process; 20μm nickel-chromium G alloy foil material was developed, and the prepared material A batch trial has been implemented.