At present, 5G can be said to be the focus of chasing in major industries. 5G brings convenience and hope to people, but also brings a series of problems, such as more power consumption and greater heat.
The heat generation problem of 5G is very serious. At the same time, the construction of 5G is also under way without delay. In this case, heat dissipation materials and heat-resistant materials will also usher in a new wave of markets.
Recently, many companies will expand their horizons in high heat-resistant materials. This material is a transparent resin material with a tricyclodecane (Tricyclodecane) structure, which was discovered by JSR and Tokyo Institute of Technology.
Using this monomer as a polymer raw material, it is expected to develop optical properties such as high refractive index, high Abbe number, low hygroscopicity, high thermal stability, and high glass transition temperature (Tg) New transparent resin with many characteristics. It is planned to apply this material to the use of transparent refractive materials such as Urethane, Acrylic and Polycarbonate (PC), and further achieve the goal of commercialization.
In addition to the above-mentioned high-temperature-resistant transparent resin, there is also an oxide-based ceramic material. This kind of ceramic material has a thermal expansion rate of minus 187 ppm for every 1 ° C rise in temperature at room temperature. When this ceramic material with a highly negative linear thermal expansion coefficient is used as a filler, only a small amount is required Adding it is expected to achieve the function of adjusting thermal expansion. It is currently planned to apply this material to 5G related electronic parts.
This kind of film is suitable for the polyphenylene sulfide (PPS) film of 5G circuit board. Compared with the general PPS film, its heat resistance is also increased by 40 ℃.
In addition, it will promote the industrialization of the newly developed exclusive thermal conduction material "Tran-Q Clay". "Tran-Q Clay" has a thermal conductivity of 2.8W / (mK), has a heat resistance of 200 ° C and excellent insulation. In addition, the thermal conductivity or hardness can be adjusted through the material design. No hardening time and no stickiness Tired, so it is expected to help improve productivity during assembly.