JSR Corporation (Representative Director CEO: Eric Johnson) has developed an insulation material with low dielectric constant and low dielectric loss for 5G communication systems, and has started selling it.
In the field of high-frequency waves using 5G, printed circuit board insulation materials with low dielectric constant and low dielectric loss characteristics are required to reduce the loss during signal transmission. JSR makes full use of its proprietary synthesis technology to develop insulating materials for high-frequency printed circuit boards with low dielectric constant and low dielectric loss. This material is the basic material of FCCL (Flexible Copper Clad Laminate) used in smartphones, etc., and this material has a very high adhesion to roughened copper foil; in addition, it can maintain excellent performance when used in high temperature and humid environments. Electrical characteristics. In order to reduce the loss of the signal during the transmission process, the surface of the copper foil is required to be smooth; on the other hand, to ensure that the copper foil and the insulating film maintain sufficient adhesion, the surface of the copper foil is also required to have a certain degree of roughness. In the past, if the roughening treatment (ie, roughening the copper foil surface treatment method) of the "anchoring effect" of the copper foil with an enlarged surface area and a three-dimensional structure was not performed, sufficient bonding force may not be obtained. This material developed by JSR It also has a high adhesion to copper foils that are not highly roughened.
In addition, this material is a thermosetting material, which has high fluidity before curing, and is also excellent in the embeddability of high-frequency printed circuit board wiring. It is also used in temperatures below 200 ° C for ordinary equipment. This material can be used. Opening is a necessary condition for connecting the wiring between layers of printed circuit boards. This material is also excellent in "opening processability"; it can also be closely adhered to the plating.
5G is a communication technology for mobile phones. Its transmission speed is 100 times that of today, and the network capacity is 1000 times. Japan plans to start 5G operation in 2020, and its demand is expected to increase.
From July 17th to 19th, the 5G and IoT communication exhibition will be held at the Tokyo Big Sight (Tokyo International Exhibition Center) Qinghai Exhibition Building. We will jointly exhibit with Hubei Omar Electronic Materials Co., Ltd. Low Loss TPE using this material. (Thermosetting Polyether) FCCL.
In the future, we will continue to base on the corporate philosophy of “Materials Innovation ~ Use materials to create value and contribute to human society (people, society, environment)”, and provide more added value for customers.