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New electromagnetic shielding film developed by China leading manufacturer of electromagnetic shielding film for flexible circuit board (FPC) is patented Hay:F05BDLK

On July 5, BDLK Magnetic Materials Technology Co., Ltd. issued the "Announcement on Obtaining Patent Certificates." The announcement showed that the company received a patent certificate issued by the State Intellectual Property Office of the People's Republic of China. "Thermoplastic electromagnetic wave shielding film", the patent number is ZL201510381360.5. Counting from the application date of June 30, 2015, BDLK has a patent right period of twenty years.

As early as 2013, the electromagnetic shielding film for FPC was officially listed as a company's R & D project. At present, the product has formed a stable formula, began mass production and market expansion, and formed part of sales. The company's current production capacity is about 2.4 million square meters per year, and the capacity utilization rate is 7.05%.

On May 24, BDLK stated that its subsidiaries competed for the right to use state-owned construction land, and agreed that the company would invest in the "LK Electronic Materials R & D and Industrial Base Project" in Chengmei Petrochemical Park. The project content is to build electromagnetic wave shielding film, pressure R & D and production base for test films and other products. The total planned investment of the project is 500 million yuan, and the construction period is 36 months. After the project is completed and put into production, it is expected to realize an output value of 400 million yuan / year.

With the coming of the 5G era, signal crosstalk will become the core problem to be solved, and the market's demand for electromagnetic shielding will also increase significantly. The market size of electromagnetic shielding films located in upstream raw materials will also continue to expand. BDLK layout electromagnetic shielding film will effectively meet market demand.

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